Silicone Die Attach Adhensive

On silicone die attach adhensive of methyl silicone resin, we provide D300H series products. After curing, the hardness reaches 58D. The applicable power is generally 0.2W~1.0W. The size of bondable chip is not less than 8*15 mil2 and thermal conductivity is 0.2 W/m·K;
On silicone die attach adhensive of phenyl silicone resin, after curing, the high hardness reaches 78D. The applicable power is generally 0.2W and below. The size of bondable chip is not less than 6*10 mil2 and thermal conductivity is 0.2 W / m K.