固晶底胶
Category:
界面连接材料
甲基有机硅树脂类LED用固晶胶，提供D300H系列产品，固化后硬度达到58D，适用功率一般为0.2W~1.0W，可黏结的芯片尺寸，不低于8*15 mil2，导热率为0.2 W/m·K;
苯基有机硅树脂类LED用固晶胶，固化后硬度高，达到78D，适用功率一般为0.2W及以下，可黏结的芯片尺寸，不低于6*10 mil2，导热率为0.2 W/m·K。
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