SILICON-W series
Category:
SILICON Series
LED chip is the core part of LED device, and the die attach adhensive is used to bond LED chip and bracket. Its thermal conductivity, yellowing resistance, light transmittance and bonding strength directly determine the luminous efficiency, chip size and service life of LED device.
The SILICON-W series is a single component, medium viscosity, high thermal conductivity chip adhesive with pure methyl silicone composite aluminum oxide filler. The thermal conductivity covers 0.6W-1W. It has excellent characteristics of high temperature resistance and UV resistance. The minimum chip size can be bonded up to 10 * 18 mil2. The applicable power is generally more than 1W. It has excellent aging performance, good stability, and is easy to operate. The product meets the RoHS requirements of EU, and is non-toxic, non corrosive and non radioactive.
| Product Performance |
Unit |
W7005S |
| Appearance |
/ |
白色 |
| Viscosity |
mPa.s @25 °C |
3500~9500 |
| Volatile Matter |
% |
＜0.50 |
| Hardness |
Shore D |
75~85 |
| Thermal Conductivity |
W/m·K |
0.60~1.00 |
|
Si/Ag Cohesive Strength |
g |
2600±300 |
| Standard Curing Conditions |
/ |
160 °C/3h |
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