SILICON-D series
Category:
SILICON Series
The SILICON-D series die attach adhensive is mainly pure methyl silicone. The minimum chip size that can be bonded is 8 * 18 mil2, and the applicable power is generally 0.5W~1W. The products have good temperature resistance and weather resistance, aging performance, good stability, and easy operation, which meet the EU RoHS requirements. According to the requirements of LED packaging for high brightness, it can be used instead of low thermal conductivity white glue. The main product of this series is methyl silicone D300H8.
| Product Performance | Unit |
D300H8 |
| Appearance |
/ |
translucent |
| Viscosity |
mPa.s @25 °C |
4000~8000 |
| Volatile Matter |
% |
＜0.50 |
| Hardness |
Shore D |
55~62 |
| Thermal Conductivity |
W/m·K |
0.20±0.02 |
| Si/Ag Cohesive Strength |
g |
3000±300 |
| Standard Curing Conditions |
/ |
160 °C/3h |
产品咨询
Jiangsu Bree Optronics Co., Ltd
East China Office:+86 151 5056 6005
Shenzhen Office:+86 151 9586 1810
Zhongshan Office:+86 158 9591 0406
Overseas： ayf@bright21cn.com
Personnel Department: 025-52706563 (Manager Qian) Email: bright21cn@126.com
Fax: 025-52706565
Address: No. 69, Liquan Road, Jiangning High tech Zone, Nanjing, Jiangsu
Copyright © 2022 Jiangsu Bree Optronics Co., Ltd
If some of the image resources on this website infringe your rights and interests, please contact us to delete them.