EPOXY series
Category:
EPOXY Series
The EPOXY series die attach adhesive is prepared employing epoxy resin as matrix, with high adhesion, can bond the minimum chip size of 4 * 5mil2. It is applicable to white light and full range RGB products with power of 0.1W and below. It has good stability, and is easy to operate, The product meets the RoHS requirements of EU, and is non-toxic, non corrosive and non radioactive. The main products of this series are DF-10 and fast curing SC101. Combined with the technical accumulation of die attach adhesive of pure epoxy system, the fast curing SC101 die attach adhesive introduced can greatly improve the packaging production efficiency, reduce the curing time, and extend the service life of devices.
| Product Performance |
Unit |
DF-10 |
SC101 |
| Appearance |
/ |
Semitransparent | Semitransparent |
| Viscosity |
mPa.s @25 °C |
16000~24000 |
9000~13000 |
| Volatile Matter |
% |
＜0.50 |
＜0.50 |
| Hardness |
Shore D |
83~86 |
84~87 |
| Thermal Conductivity |
W/m·K |
0.20±0.02 |
0.20±0.02 |
|
Si/Ag Cohesive Strength |
g |
4950±300 |
4950±300 |
| Standard Curing Conditions |
/ |
160℃/3h |
160℃/1h |
产品咨询