High thermal conductivity ceramic substrate
Category:
High Thermal Conductivity Ceramic Substrate
Our high thermal conductivity ceramic substrates include aluminum nitride and aluminum oxide, which can be applied to TPC, DBC, DPC and other types of circuit boards, and can meet the application needs of high-power LED lighting, laser diodes, TECs, UV disinfection and sterilization and other fields.
|
Technical characteristics |
Aluminum Nitride Ceramic Substrate |
|
Colour |
grey |
|
Density（g/cm3） |
3.3 |
|
Vickers Hardness (GPa) |
11 |
|
Bending Strength (MPa) |
450 |
|
Young's Modulus (GPa) |
320 |
|
Coefficient of Linear Thermal Expansion (×10-6/K) |
5.2 |
|
Thermal Conductivity (W/mK) |
170~200 |
|
Dielectric Strength (kV/mm) |
15 |
|
Volume Resistivity (Ω·cm) |
＞1014 |
|
Dielectric Constant（1MHz） |
8.5 |
|
Dielectric Loss（1MHz）(×10-4) |
3 |
|
Thickness (mm) |
0.38-0.5 |
|
Size (mm) |
140*190,120*120 |
|
Roughness (Ra) (μm) |
0.3-0.5 |
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