Metal cavity ceramic circuit board
Category:
Ceramic Circuit Board
The metal cavity ceramic circuit board adopts the cutting edge semiconductor micromachining technology, which has the characteristics of high graphic accuracy. It achieves vertical interconnection through the metal cavity electroplating technology, becoming a major technical breakthrough in the field of ceramic carrier plates. At the same time, its metal cavity enclosure dam height is 500~800 um controllable, and multi-channel heat dissipation is achieved to ensure good thermos-electric separation; It can replace LTCC/HTCC multilayer circuit board to achieve airtight packaging; It can be used in disinfection and epidemic prevention, VCSEL, laser sensing and other scenes.
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Technical Indicators |
Control Scope |
|
Surface Roughness of Cavity (μm) |
0.4-0.6 |
|
Surface Roughness of Function Area (μm) |
0.07-0.12 |
|
Warping Degree (μm) |
<100 |
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Height Range of PCS (μm) |
5-7 |
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Height Range of Full Page (μm) |
<100 |
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Mark Rate (%) |
<5 |
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